欢迎登录材料期刊网

材料期刊网

高级检索

A novel trench field stop (TFS) IGBT with a super junction (SJ) floating layer (SJ TFS-IGBT) is proposed.This IGBT presents a high blocking voltage (>1200 V), low on-state voltage drop and fast turn-off capability. A SJ floating layer with a high doping concentration introduces a new electric field peak at the anode side and optimizes carrier distribution, which will improve the breakdown voltage in the off-state and decrease the energy loss in the on-state/switching state for the SJ TFS-IGBT. A low on-state voltage (VF) and a high breakdown voltage (BV) can be achieved by increasing the thickness of the SJ floating layer under the condition of exact charge balance. A low turn-off loss can be achieved by decreasing the concentration of the P-anode. Simulation results show that the BV is enhanced by 100 V, VF is decreased by 0.33 V (at 100 A/cm2) and the turn-off time is shortened by 60%, compared with conventional TFS-IGBTs.

参考文献

[1] Bryant A T,Wan Y,Finney S J,et al.Numerical optimization of an active voltage controller for high-power IGBT converters.IEEE Trans Power Electron,2007,22(2):374
[2] Combrink F W,Mouton H T,Enslin J H R,et al.Design optimization of an active resonant snubber for high power IGBT converters.IEEE Trans Power Electron,2006,21(1):114
[3] Sheng K,Williams B W,Finney S J.A review of IGBT models.IEEE Trans Power Electron,2000,15(6):1250
[4] Laska T,Münzer M,Pfirsch F,et al.The field stop IGBT (FS IGBT)-a new power device concept with a great improvement potential.Proc ISPSD,2000:355
[5] Rahimo M,Schlapbach U,Kopta A,et al.SPT+,the next generation of low-loss HV-IGBTs.Proc PCIM,2005:361
[6] Nakamura K,Kusunoki S,Nakamura H,et al.Advanced wide cell pitch CSTBTs having light punch-through (LPT) structure.Proc ISPSD,2002:277
[7] Nakamura K,Hisamoto Y,Matsumura T,et al.The second stage of a thin wafer IGBT low loss 1200 V LPT-CSTBTTM with a backside doping optimization process.Proc ISPSD,2006:133
[8] Matsudai T,Tsukuda M,Umekawa S,et al.New anode design concept of 600 V thin wafer PT-IGBT with very low dose P-buffer and transparent P-emitter.IEE Proceedings of Circuits Devices,2004:151
[9] Chen W,Zhang B,Li Z.Area-efficient fast-speed lateral IGBT with a 3D n-region-controlled anode.IEEE Electron Device Lett,2010,31(5):468
[10] Kitagawa M,Omura I,Hasegawa S,et al.A 4500 V injection enhanced insulated gate bipolar transistor (IEGT) in a mode similar to a thyristor.Tech Dig IEDM,1993:679
[11] Mori M,Oyama K,Kohno Y,et al.A trench-gate high-conductivity IGBT (HiGT) with short-circuit capability.IEEE Trans Electron Devices,2007,54(8):2011
[12] Qian Mengliang,Li Zehong,Zhang Bo,et al.Insulated gate bipolar transistor with trench gate structure of accumulation channel.Journal of Semiconductors,2010,31(3):034002
[13] Nakamura K,Oya D,Saito S,et al.Impact of an LPT (II) concept with thin wafer process technology for IGBT's vertical structure.Proc ISPSD,Barcelona-Spain,2009:295
[14] Mori M,Uchino Y,Sakano J,et al.A novel high conductivity IGBT (HiGT) with a short circuit capability.Proc ISPSD,1998:429
[15] Green D,Vershinin K,Sweet M,et al.Anode engineering for the insulated gate bipolar transistor-a comparative review.IEEE Trans Power Electron,2007,22(5):1857
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%