半导体学报（英文版）, 2014, 35(12): 139-143. doi: 10.1088/1674-4926/35/12/126001

基金项目: Project supported by the 02 Science and Technology Key Program of the National Medium-and Long-Term Science and Technology Development Plan of China (No.2009ZX02308) and the Natural Science Foundation of Hebei Province,China (No.E2013202247).

Reducing the mechanical action of polishing pressure and abrasive during copper chemical mechanical planarization

Keywords： planarization capability

参考文献

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Reducing the mechanical action of polishing pressure and abrasive during copper chemical mechanical planarization

参考文献