采用刷涂-烧结法,分别在C/C-SiC复合材料和C/C复合材料表面制备了ZrB2基陶瓷复合涂层.利用EDS,SEM分析陶瓷涂层的成分及微观形貌,通过对比C/C-SiC基体和C/C基体的表面涂层,对C/C-SiC基体表面涂层的高温烧结机理进行了探究.结果表明:高温下C/C-SiC基体中的硅组元会溢出,造成样品质量损失;同时,溢出的硅组元能渗入到陶瓷涂层中,形成了以硅为主要黏结相,ZrB2等陶瓷相弥散分布的陶瓷涂层;与C/C基体相比,硅组元的溢出能有效促进涂层与基体之间的界面结合.在对基体进行预处理的基础上,采用低温真空脱胶,高温常压烧结,能够制备出结构致密、无裂纹并与基体结合牢固的ZrB2基陶瓷涂层.
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