通过考察P在纯锡中的作用，探讨微量P, P/Cu/Zn对Sn-Bi基合金焊料组织、拉伸性能、形变断裂的影响。结果显示在纯锡中添加1%（质量分数，下同）P，能够提高强度、刚度，降低塑性；但仅0.1%的P会恶化Sn-Bi合金的力学性能，这和P元素在金属基体内的存在形式以及基体组织有关。在锡基合金中，P以Sn-P合金的形式分布在相界或晶界上，限制载荷作用下金属的形变扩散与转移。因此在Sn-1P合金中，分布在β-Sn基体上的化合物，起强化作用；在Sn-Bi合金中，Sn-P化合物则加剧加载过程中的形变不匹配，成为裂纹萌生与扩展的薄弱环节，导致合金倾向于脆性断裂；最后，在加入微量P元素的基础上再进行Zn/Cu的合金化，可以改善Sn-Bi合金系列的微观组织，提高强度，增加合金最大流变应力。
Micro alloy metals P or P/Cu/Zn were added into Sn-Bi alloy to investigate the doping effects on microstructure, mechanical property, deformation fracture from the function of P in pure tin. The results show that doping 1%(mass fraction, same as below) P to pure tin can improve the strength and stiffness, decrease the plasticity. Only 0.1%P additive degenerates the mechanical property of Sn-Bi alloy, this is related to the existing form of element P in the base metal and the microstructure of the base metal. In Sn base alloy, P is distributed in phase or grain boundaries in the form of Sn-P intermetallic compounds (IMC), restricting the diffusion and shifting of deformation. Therefore, Sn-1P alloy, IMC distributed in beta-tin base plays a role of strengthening in pure tin doped situation, in Sn-Bi alloy instead, enhancing the deformation mismatch under loading becoming the weak spots where cracks may initiate and propagate, and leading to brittle fracture. Finally, addition of P/Zn/Cu simultaneously to Sn-Bi alloy, the doping can optimize the microstructure, improve the strength and enhance the ultimate tensile strength (UTS) of Sn-Bi alloys.
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