利用扫描电镜及其能谱仪、同步热分析仪以及对比实验来分析Sn对电真空Ag‐Cu钎料微观组织、熔化特性和钎焊性能的影响。结果表明：Sn添加4％（质量分数，下同）时，Ag60Cu钎料中没有脆性β‐Cu相生成，对钎料的加工性能影响不大；随着Sn含量的增加，Ag60Cu钎料的液相线温度逐渐降低，同时固相线温度降低幅度更大，导致熔化温度范围扩大，钎料的填缝性能变差；对于含Sn为4％的Ag60Cu钎料，与紫铜的铺展性能以及冶金结合性能都接近于BAg72Cu钎料，并可通过压力加工制成片状钎料，可以用来替代BAg72Cu片状钎料使用。
Influence of Sn on microstructure ,melting characteristic and brazing performance of electric vacuum Ag‐Cu filler metal was studied by using scanning electronic microscope (SEM ) with energy disperse spectroscopy (EDS) ,differential scanning calorimetry (DSC) and contrast tests .The results show that ,w hile the addition of Sn is 4% (mass fraction ,the same below ) ,there is no brittle β‐Cu phase in Ag60Cu filler metal ,the effect on the processing performance is not obvious ;with the in‐crease of Sn content ,the liquidus temperature of Ag60Cu filler metal decreases gradually ,but the sol‐idus temperature drops drastically ,resulting in wider melting temperature range ,and worse gap filling ability of filler metal .The Ag60Cu filler metal with Sn content of 4% has good spreading and metal‐lurgical bonding abilities on copper plates ,which are closer to that of BAg72Cu filler metal ,and it can be processed into flake filler metal to replace the BAg 72Cu flake filler metal to be used .
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