以K H560在碱性条件下水解缩合制备的环氧基倍半硅氧烷(EPb‐POSS )为改性剂,对双酚A型环氧树脂(E‐51)/4,4′‐二氨基二苯砜(DDS)进行改性,制备EPb‐POSS/E‐51/DDS改性树脂体系,研究该树脂体系的固化工艺和不同含量的EPb‐POSS对改性树脂体系力学性能和热稳定性的影响。结果表明,EPb‐POSS对改性树脂的固化工艺及其刚性影响不大,但是能显著提高其韧性。POSS含量为1.0%(质量分数)时,改性树脂的冲击强度达到49.2kJ · m2,提高了90.0%,并表现为明显的韧性断裂;弯曲强度132.8M Pa ,略有提高;初始分解温度378.0℃,提高了26.0℃。
The bisphenol A epoxy resin (E‐51) /4 ,4′‐diaminodiphenyl sulfone (DDS) was modified by the epoxy silsesquioxane (EPb‐POSS) ,which was synthesized by hydrolytic condensation of (γ‐glycidoxypropyl)trimethoxysilane under basic condition , to prepare EPb‐POSS/E‐51/DDS modified resin systems .The curing process and the influence of EPb‐POSS with different contents on the me‐chanical properties and thermal stability of the modified resin systems was studied .The results show that although the EPb‐POSS have little effect on the curing process and the stiffness of the modified resin ,it can significantly improve the toughness ;w hen the mass fraction of EPb‐POSS is 1 .0% ,the impact strength of the modified resin can reach 49 .2kJ · m2 ,is increased by 90 .0% ,and shows obvi‐ous toughness fracture ;the bending strength is 132 .8MPa ,is slightly increased ;and the initial de‐composition temperature is 378 .0℃ ,is increased by 26 .0℃ .
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