以2-苯基咪唑(2PZ)为芯材,聚甲基丙烯酸缩水甘油酯(PGMA)为壁材,采用溶剂挥发技术,成功地制备了一种新型潜伏性热释放型2PZ-PGMA微胶囊固化剂.系统地研究了溶剂种类及油水比、表面活性剂种类及用量、核壳投料比等参数对微胶囊形貌、粒径大小及分布、囊芯2PZ含量及产率等的影响,最终优化了微胶囊固化剂的制备工艺:当溶剂为二氯甲烷,油水比(体积比)为4∶5,表面活性剂为0.4％(质量分数)SDS,核壳投料比为1∶1时制备的微胶囊固化剂最优.
参考文献
| [1] | 史有强,张秋禹,尹常杰,张宝亮.微胶囊固化剂的制备方法及应用[J].中国胶粘剂,2010(08):43-48. |
| [2] | SHIGEAKI F;YUTAKA O;YOSHII M .Microcapsuletype latent curing agent for epoxy resin,method for producing the same,one-component epoxy resin composition epoxy resin composition,and epoxy resin cured product[P].JP,102610,2009-05-14. |
| [3] | Minami H;Kanamori H;Hata Y;Okubo M .Preparation of microcapsules containing a curing agent for epoxy resin by polyaddition reaction with the self-assembly of phase-separated polymer method in an aqueous dispersed system[J].Langmuir: The ACS Journal of Surfaces and Colloids,2008(17):9254-9259. |
| [4] | YUTAKA O;SHIGEAKI F;YOSHII M .One-pack epoxy resin composition[P].JP,317236,2008-12-12. |
| [5] | Toshiaki M;Koji F .Microcapsule for epoxy resin curing agent[P].JP,247179,1993-09-24. |
| [6] | YUKO S;HIROYUKI O;MISAKI M et al.Microcapsule type curing agent and curable resin composition containing the same[P].JP,056891,2008-08-13. |
| [7] | SHIGEAKI F;YUTAKA O;YOSHII M .Microcapsule type latent curing agent for epoxy resin,method for producing the same,one-component epoxy resin composition,and epoxy resin cured product[P].JP,158114,1993-09-24. |
| [8] | 泽冈龙治;河内真二;村木俊夫 .微胶囊型固化剂,其制备方法,热固性树脂组合物,预浸渍物及纤维增强的复合材料[P].CN,1112142,1995-11-22. |
| [9] | 池村和弘 .封装半导体用环氧树脂组合物和半导体器件[P].CN,1256288,2000-06-14. |
| [10] | 原田忠昭 .半导体密封用树脂组合物、半导体装置、半导体晶片、半导体安装结构体[P].CN,1340586,2002-03-20. |
| [11] | 许时婴;张晓鸣;夏书芹.微胶囊技术一原理与应用[M].北京:化学工业出版社,2006 |
| [12] | 宋健;陈磊;李效军.微胶囊化技术及应用[M].北京:化学工业出版社,2001:189-199. |
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