以石墨板为基材模拟不同大小的深孔狭缝,通过超声辅助化学镀铜的方法,研究深孔狭缝内的镀铜层的影响因素,分别以甲醛和次磷酸钠为还原剂进行无敏化活化化学镀铜,通过SEM观察镀层的形貌和微观结构,用XRD对镀层成分进行分析.实验结果表明,以甲醛为还原剂时,石墨板基材对化学镀铜具有催化作用,在无敏化活化前提下,即可发生镀铜反应.深孔狭缝的大小及在镀液中的放置方向影响狭缝内部镀铜效果.大于500 μm的狭缝及通孔,不受放置方向的影响,内部均可产生镀铜.100～500μm之间的狭缝及大于500μm的盲孔,镀铜情况受放置方向的影响:竖直放置时,狭缝与盲孔内均可产生镀铜;水平放置时,狭缝和盲孔内壁均不能被铜完全包覆.
参考文献
| [1] | 姚七妹,谭镇,周颖,邱介山.模板法制备多孔炭材料的研究进展[J].炭素技术,2005(04):15-21. |
| [2] | Xinying Wang;Jiming Zhong;Yimin Wang .A study of the properties of carbon foam reinforced by clay[J].Carbon: An International Journal Sponsored by the American Carbon Society,2006(8):1560-1564. |
| [3] | Vignoles, GL;Gaborieau, C;Delettrez, S;Chollon, G;Langlais, F .Reinforced carbon foams prepared by chemical vapor infiltration: A process modeling approach[J].Surface & Coatings Technology,2008(5/7):510-515. |
| [4] | M. Almajali;K. Lafdi;P.H. Prodhomme .Mechanical properties of copper-coated carbon foams[J].Carbon: An International Journal Sponsored by the American Carbon Society,2010(5):1604-1608. |
| [5] | Klett J;Lowden R;McMillan A.Oxidation protection of graphite foams[A].Lexington USA,2001 |
| [6] | Sung Y et al.Electroless copper deposition by non-isothermal deposition technology[J].Materials Chemistry and Physics,2009,113(01):303. |
| [7] | Lin YM.;Yen SC. .Effects of additives and chelating agents on electroless copper plating[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2001(1/4):116-126. |
| [8] | Hanna F;Hamid Z A;Aal A A .Controlling factors affecting the stability and rate of electroless copper plating[J].Materials Letters,2004,58(1-2):104. |
| [9] | 赵继周.高等无机化学[M].北京:北京师范大学出版社,1987 |
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