超声波金属焊接具有低温、低压及低能耗的加工优点,可用于埋入智能单元光纤布拉格光栅传感器(FBG),制备3D智能金属结构.而在埋入金属基体过程中FBG易应力失效.采用复合镀镍方法对FBG进行预保护,基于金属化FBG(MFBG)使用超声波焊接工艺埋入至厚度300 μm的AA6061铝基体中,以获得3D智能金属结构.结果表明:超声波焊接下MFBG可埋入铝基体中;对超声波焊接制备的3D智能金属结构进行了温度传感与透射谱检测分析,温度灵敏度提高了1倍多,且温度传感线性度较好,有效抑制了温度交叉敏感性;埋入铝基体后FBG谐振谱布拉格峰出现了蓝移与峰值损耗降低.
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