利用热模拟技术、金相观察及定量统计,通过分析Fe-40Ni-Ti合金快速升温过程中试样不同部位的晶粒长大规律,模拟研究了焊接过程中奥氏体晶粒的长大行为.结果表明:温度最高的中心线附近晶粒长大显著,5 s内温度达到1350℃时,其尺寸达到了180 μm;而距离中心线4 mm处的热影响区及母材(试样端部)晶粒变化不大,在80 μm左右.金相观察发现TiN颗粒对晶界迁移产生了明显的阻碍作用.
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