采用力学性能和电导率测试及透射电子显微镜等方法,研究了不同时效工艺对Cu-0.45Cr-0.15Zr-0.05Mg合金硬度和电导率等性能的影响规律.结果表明:合金在一级时效工艺(950℃×1h固溶+70％冷变形+520℃×2.5h时效)下有很强的时效强化效应,合金的显微硬度和电导率分别为155HV和85％ IACS;采用二级时效工艺(950℃×1h固溶+70％冷变形+520℃×2h时效+60％冷变形+450℃×2h时效),合金在保持较高的电导率的同时强度得到较大提高.显微硬度为190HV,比一级时效提高了22.5％,而电导率保持在80％左右.显微组织分析表明,高强度主要来源于冷变形引起的亚结构强化和弥散相的析出强化.二级时效工艺可促进析出相的析出,析出的弥散质点对基体的回复和再结晶阻碍作用强烈.析出相与冷变形过程中产生的位错交互作用使析出相不仅阻碍位错的运动而且沿密集且分布均匀的位错快速析出,促进合金强度提高.
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