采用丝束电极方法结合电化学阻抗技术研究了Cu在0.6 mol/L NaCl液滴下的腐蚀行为.结果表明:液滴下Cu电极表面表现出明显的不均匀电流分布特征,开始时呈现中心阴极边缘阳极的分布,随腐蚀时间的延长电流分布会发生极性反转,呈现中心阳极边缘阴极的分布.对电极表面形貌及产物的分析结果表明,开始时液滴边缘区即有红棕色产物大量积累,而中心区氧化膜生成则较慢.随着腐蚀时间的延长,电极表面逐渐被红棕色氧化膜完全覆盖,中心区氧化膜开始破坏并生成绿色产物,其破坏程度强于边缘区.据此对液滴下Cu的腐蚀机理进行探究.
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