为研究不同退火温度下Cu/Ni纳米多层膜的结构与力学性能稳定性,采用电子束蒸发镀膜技术在Si(100)基片上沉积不同周期(Λ为4,12,20 nm)的Cu/Ni多层膜,在真空条件下对试样进行温度为200℃和400℃,时间为4h的退火处理,分析了沉积态(未退火态)与退火态Cu/Ni多层膜纳米压痕硬度、弹性模量与微结构的演变,讨论了不同调制周期Cu/Ni多层膜的热稳定性.结果表明:200℃下4h退火后,Λ为4,12和20 nm的Cu/Ni多层膜均保持了硬度与弹性模量的热稳定性.而在400℃下4 h退火后,Λ为12 nm的Cu/Ni多层膜出现了硬度和弹性模量的软化现象,硬度由6.21 GPa降低至5.83 GPa,弹性模量由190 GPa降低至182 GPa.这是南于共格界面被破坏,界面共格应力对Cu/Ni多层膜力学性能贡献作用削弱导致的.
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