以双马来酰亚胺树脂(BMI)为树脂基体,二烯丙基双酚 A(DABA)为增韧剂,γ-缩水甘油醚氧丙基三甲氧基硅烷(KH-560)表面改性的 SiC颗粒-SiC晶须(SiCP-SiCW)为复配导热填料,浇注成型制备 SiCP-SiCW/BMI导热复合材料,分析研究SiC形状、用量、质量比及表面改性对SiCP-SiCW/BMI 导热复合材料的导热性能、介电性能、力学性能和热性能的影响。结果表明,当改性 SiCP-SiCW 用量为40wt%且 SiCP∶SiCW 质量比为1∶3时,SiCP-SiCW/BMI导热复合材料具有最佳的综合性能,导热系数λ为1.125 W(m·K)-1,介电常数ε为4.12,5%热失重温度为427℃。
Functionalized SiC particle-SiC whisker (SiCP-SiCW )hybrid fillers byγ-glycidoxypropyltrimethoxysilane (KH-560)were performed to fabricate the functionalized SiCP-SiCW/bismaleimide (SiCP-SiCW/BMI)thermal conductivity composites,BMI as the polymeric matrix and diallylbisphenol A (DABA)as a toughening agent, respectively.Effects of the shape,content,compound and surface functionalization of SiC fillers on the thermal conductivities,dielectric & mechanical properties and thermal stabilities of the functionalized SiCP-SiCW/BMI thermal conductivity composites were investigated.The results show that the functionalized SiCP-SiCW/BMI thermal conductivity composite with 40wt% functionalized SiCP-SiCW (1∶3,mass ratio)hybrid fillers exhibits the best comprehensive performance,the corresponding thermally conductive coefficientλof 1.125 W(m·K)-1 ,dielectric constantεof 4.12,and 5wt% thermal mass loss temperature of 427 ℃.
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