本文通过滑移爆轰试验研究了低载荷下(2～4GPa)高纯铜试样的层裂行为.对爆轰后的层裂试样进行了金相和EBSD分析.金相分析结果表明:在滑移爆轰试样主层裂面上存在层裂面分叉的现象,在边部存在与主层裂面垂直的层裂面.在微结构相同的试样中,随着冲击压力的增大,孔洞分布区域的面积增大、微孔洞的贯通现象也更加明显.EBSD分析的结果表明:爆轰试验导致试样层裂区域晶粒尺寸减小,晶粒沿垂直于冲击应力的方向被拉长.爆轰时由于冲击压力极高,变形时间短(10μs),在试样中形成变形孪晶.层裂试样中微孔洞多在多条一般大角度晶界构成的三叉节点处形核,多条Σ3晶界构成的三叉节点对损伤形核有抵抗作用.损伤多形核于泰勒因子(TF)值较高的晶粒与其他晶粒构成的晶界上.TF值较高的晶粒中损伤的面积更大些.
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