目的：设计合理的抛光工艺方案,获得平整的阵列光纤组件端面。方法采用单因素实验法研究抛光工艺参数对阵列光纤表面粗糙度与光纤凸起量的影响,利用光学表面轮廓仪与扫描电镜进行分析与观察。结果在抛光液磨粒质量分数为2%,抛光液流量为15 mL/min,抛光压力为50 kPa,抛光盘转速为30 r/min的条件下,可以获得平整的阵列光纤组件端面。结论应用化学机械抛光技术加工阵列光纤组件,并设计合理工艺方案,可获得平整的阵列光纤组件端面,其表面粗糙度可低至42.6 nm,光纤凸起值可低至0.14μm。
ABSTRACT:Objective To obtain the flat end face of optical fiber array by designing proper polishing process plan. Methods The effects of polishing process parameters on the surface roughness of the optical fiber array and fiber projection were studied using sin-gle factor experiments, and the surface morphology was examined by Scanning Electronic Microscope and Optical Profilometer. Re-sults Flat end face of optical fiber array was obtained under the conditions of particle concentration of 2%, polishing slurry flow rate of 15 mL/min, polishing pressure of 50 kPa, and rotation speed of 30 r/min. Conclusion Using chemical mechanical polishing to process optical fiber array, in combination with designing proper polishing process parameters, a perfect end-face of optical fiber ar-ray with surface roughness of 42. 6 nm and fiber projection of 0. 14 μm was achieved.
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