目的：( Ti,Cu) N薄膜是一种新型的硬质涂层材料,关于其结构和性能的研究报道还较少。研究脉冲偏压对( Ti,Cu) N薄膜结构与性能的影响规律,以丰富该研究领域的成果。方法将多弧离子镀和磁控溅射离子镀相结合构成复合离子镀技术,采用该技术在不同脉冲偏压下于高速钢基体表面制备( Ti,Cu) N薄膜。分析薄膜的微观结构,测定沉积速率及薄膜显微硬度,通过摩擦磨损实验测定薄膜的摩擦系数。结果在不同偏压下获得的(Ti,Cu)N薄膜均呈晶态,具有(200)晶面择优取向,当脉冲偏压为-300 V时,薄膜的择优程度最明显。随着脉冲偏压的增加,薄膜表面大颗粒数量减少且尺寸变小,表面质量提高；沉积速率呈现先增大、后减小的趋势,在脉冲偏压为-400 V时最大,达到25.04 nm/min；薄膜硬度也呈现先增大、后减小的趋势,在脉冲偏压为-300 V时达到最大值1571.4 HV。结论脉冲偏压对复合离子镀( Ti,Cu) N薄膜的表面形貌、择优取向、沉积速率和硬度均有影响。
Objective There are few reports on the microstructure and properties of ( Ti,Cu) N thin film, which is a new type of hard coating. This work investigated the effects of pulsed bias on the structure and properties of ( Ti,Cu) N film, enriching research results of this area. Methods The hybrid ion plating technique, realized by simultaneously using arc ion plating and magnetron sputtering, was employed to deposit ( Ti,Cu) N film samples onto high-speed steel under different pulsed biases. Surface morpholo-gy, crystalline structure, thickness, micro-hardness as well as friction coefficient of the coatings were measured respectively. Results All the films were crystalline in spite of the varying bias. The ( Ti,Cu) N coatings deposited at-300 V had the most obvi-ous preferred plane (200). Both the quantity and the size of the macro-particles on the film surface became smaller with the in-creasing pulsed bias, presenting an improved surface quality. Deposition rate of the ( Ti,Cu) N film increased first and then de-creased with increasing pulsed bias, and the maximum deposition rate, 25. 04 nm/min, was achieved at a pulsed bias of-400 V. Micro-hardness of the films changed similarly to the deposition rate with the varying pulsed bias, and it reached the maximum value of 1571. 4HV at-300 V. Conclusion The pulsed bias had an obvious influence on the surface morphology, crystalline orientation, deposition rate and microhardness of ( Ti,Cu) N films.
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