磁控溅射以溅射温度低、沉积速率高的特点而被广泛应用于各种薄膜制造中,如单层或复合薄膜、磁性或超导薄膜以及有一定用途的功能性薄膜等,在科学领域以及工业生产中发挥着不可替代的作用.在介绍磁控溅射原理的基础上,阐述了靶材刻蚀机理,针对传统磁控溅射系统中靶材利用率低、刻蚀形貌不均匀等现状,从改善靶面磁场分布和模拟靶材刻蚀形貌两方面对国内外最新的研究进展进行总结与分析.研究表明,通过改变磁体的空间布置或增加导磁片能有效改善靶面磁场分布,采用适当的运动部件实现磁场和靶材的相对运动能有效扩展靶材的溅射面积,提高靶材利用率.在靶材刻蚀模拟中,通过改变溅射过程中的工艺条件(磁场强度、工作电压等)来研究靶面等离子特性,结果显示靶材刻蚀形貌会随着磁场强度的增加而变窄,靶材刻蚀速率会随工作电压的增大而增大等,这些研究成果对磁控溅射工艺参数的优化具有指导意义.最后,对靶材冷却系统的设计、靶材表面处理等对溅射过程的影响进行了简要展望.
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