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在信息科技产业领域,微电子产品的多功能化、高性能化及轻薄化的发展大大推动了超高密度和超大规模集成电路关键技术及材料的发展.为了解决高密度集成所带来的信号延迟和功率损耗等问题,新一代高性能低介电甚至超低介电材料的开发成为这一领域最重要的研究方向之一.聚酰亚胺作为重要的绝缘封装材料,广泛应用于航天航空和微电子信息领域.本文综述了近年来国内外关于低介电常数聚酰亚胺薄膜的研究进展,并对未来高性能低介电聚酰亚胺材料的研究方向作了展望.

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