采用SiO2与聚酰胺酸复合,制备了具有爽滑性的聚酰亚胺(PI)薄膜,对薄膜的拉伸强度、断裂伸长率、动摩擦因数等性能进行测试分析,并采用SEM、TMA和TGA对薄膜进行表征.结果表明:未添加SiO2的PI薄膜表面光滑,动摩擦因数为0.568,薄膜卷起后无爽滑性,容易产生粘连.加入SiO2后,SiO2可在PI薄膜表面形成弧形凸起,使动摩擦因数下降,爽滑性提高.当加入平均粒径为1.5μm、质量分数为0.1%~0.8%的SiO2粒子时,随着SiO2质量分数的增加,PI薄膜的拉伸强度和断裂伸长率不断增大,热膨胀系数缓慢降低,耐热性增加,动摩擦因数为0.423~0.377,可避免PI薄膜在生产应用过程中出现粘连问题.
Slippery polyimide films were prepared from SiO2 and polyamide acid. The tensile strength, elongation at break, and kinetic friction coefficient of the film were measured, and the film was character-ized by SEM, TMA, and TGA. The results show that the PI film without SiO2 has smooth surface, and its kinetic friction coefficient is 0.568. The film has nosmoothness when rolled up, and it is easy to stick together. After adding SiO2, the polyimide film surface would form arc-shaped embossments, which make the kinetic friction coefficient decrease and the smoothness increase. When the adding amount of SiO2 particles is 0.1%~0.8% and the average grain diameter is 1.5 μm, with the increase of SiO2 content, the tensile strength and elongation at break increase, while the coefficient of thermal expansion decreases slowly, the heat resistance increases, and the kinetic friction coefficient is 0.423~0.377, so the conglutination problem in polyimide production and application can be avoided.
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