针对有机硅灌封树脂力学性能差、导热性差、粘结强度低等特点,设计了新型的有机硅灌封胶配方,通过表面活性剂与气相二氧化硅有效互配、导热填料互配、增黏剂的挑选与有效互配、MQ树脂与有机硅树脂的互配,改善灌封胶的各项性能.结果表明:新型有机硅灌封树脂的力学性能、导热性能和粘结强度均得到提高,拉伸强度达到3.5 MPa,断裂伸长率达到68%;导热系数大于1.4 W/(m·K),剪切强度大于1.8 MPa,且具有良好的防沉降性能,满足电机封装的应用要求.
Aiming at the poor mechanical properties, poor thermal conductivity, and low bonding strength of organosilicon encapsulants, a new silicone encapsulants formulation was developed. The performance of encapsulants were improved by the effective coordination of surface active agent and silicon gas, the cooperation of thermal conductive fillers, the selection and effective coordination of tackifiers, and the coordination of MQ resin and organosilicon resin. The results show that the mechanical properties, thermal conductivity, and bonding strength of the novel encapsulant are enhanced. The tensile strength reaches 3.5 MPa, the elongation at break reaches 68%, the thermal conductivity is greater than 1.4 W/(m·K),the shear strength is greater than 1.8 MPa, and the novel encapsulant has good anti-settling performance,which meet the application requirements of motor packaging.
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