采用原位电阻法测量了高温器件焊面多层金属膜Au/Ti,Pd/Ti在300℃不同气氛下电阻随退火时间的变化.结果表明,300℃退火时Au膜中存在Ti的扩散导致电阻显著增加,但电阻随时间变化与气氛的关系不大.电阻变化的规律基本符合一维有限厚无限大平面体扩散模型.空气中退火时电阻增加小于Ar气氛下退火电阻增加,可用Au膜中Ti扩散速率的差异来解释.Pd/Ti膜在Ar气氛下退火时电阻基本无变化,但空气中退火时因Ti层部分氧化而导致膜的电阻少量增加(约3%).
参考文献
[1] | Freytage J, Wennemuth I. In: Zhang M, Tu K N eds.,Proc 5th Int Conf on Solid-State and Intergrated Circuit Technology, Beijing: Electronics Industry Press, 1998:219 |
[2] | Fisher J S, Hall P M. Proc IEEE, 1971; 59:1418 |
[3] | Morabito J M, Thomas J H, Lesh N G. IEEE Trans Parts Hybrids Packag, 1975; 11:253 |
[4] | Tisone T C, Drobek J. J Vac Sci Technol, 1971; 9:271 |
[5] | Poate J M, Turner P A, DeBonte W J. J Appl Phys, 1975;46:4275 |
[6] | Feldman I C, Mayer J W. Fundamentals of Surface and Thin Film Analysis. New York: Elsevier Science Publishing Co Inc, 1986:163 |
[7] | Vanhecke B, Roggen J, Beyne E, Deceuninck W, Deschepper L, Stals L. VTE, 1992; 4:64 |
[8] | Hall P M, Morabito J M, Poate J M. Thin Solid Film,1976; 33:107 |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%