针对通孔焊点进行了热冲击的可靠性测试,以非破坏性和破坏性的实验方法,对比分析了波峰焊点和再流焊点的抗热疲劳能力.结果表明,CTE(热膨胀系数)失配是焊点产生裂纹的主要原因,而焊点形态的差异又使得再流焊点内部断裂程度不同于波峰焊点.再流焊点裂纹产生在钎料内部;而波峰焊点由于具有饱满的圆角过渡形态,裂纹产生在镀铜孔与线路板的连接拐角处.裂纹的产生导致了两种焊点强度的降低,对其电性能的影响却甚微.
参考文献
| [1] | Zarrow P, Kopp D. Print Circ Design, 1997; 14(2): 25 |
| [2] | Glenn R R, Nguyen N. Circ Assem, 1998; 9(11): 32 |
| [3] | Belmonte J, Zarrow P. Circ Assem, 1996; 7(9): 36 |
| [4] | Hymes L. Circ Assem, 1999; 10(4): 28 |
| [5] | Glenn R R. Circ Assem, 1999; 10(4): 32 |
| [6] | William E. Coleman, Denis J, Julie R, Bradbury-Bennett.Solder Surf Mount Technol, 2000; 12(3): 8 |
| [7] | Rutter G. Electr Pack Prod, 1997; 37(6): 99 |
| [8] | Islam J. Electr Prod, 2000; 29(2): 29 |
| [9] | Barker D, Pecht M, Dasgupta A, Naqvi S. J Electron Packag, 1991; 113(2): 149 |
| [10] | Colin Lea. In: Des Plaines ed, Proc Tech Program Natl Electron Packag Prod Conf, California, Anaheim: Cahner Exposition Group, 1991:23 |
| [11] | Zhang W, Wang C Q. In: Zhang Qun ed, HDP's02-IEEE Symp on High Density Packag and Component Failure Analysis in Electron, Shanghai: IEEE, 2002:221 |
| [12] | Wang Z P, Tan Y M, Chua K M. Microelectron Reliab,1999; 39:1351 |
| [13] | Zhao X J, Wang C Q, Wang G Z, Zheng G Q, Yang S Q.IEEE Trans Electron Packag Manu, 2000; 23(2): 87 |
| [14] | Kanchanomai C, Miyashita Y, Mutoh Y. Int J Fatig, 2002;24:987 |
| [15] | Tu P L, Chan Y C, Tang C W, Hung K C, Lai J K L.IEEE Trans Adv Pack, 2001; 24(2): 197 |
| [16] | Chan Y C, So Alex C K, Lai J K L. Mater Sci Eng B,1998; 55:5 |
| [17] | Pang H L J, Tan K H, Shi X Q, Wang Z P. Mater Sci Eng A, 2001; 307:42 |
| [18] | Lee H T, Chen M H. Mater Sci Eng A, 2002; 333:24 |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%