采用雾化干燥结合氢还原工艺制备W-20%Cu(质量分数)纳米复合粉,分别用XRD,SEM,TEM等手段表征了制备过程中各步骤的产物及最终复合粉.结果表明该复合粉的粒子平均尺寸为240 nm,粒子中弥散均匀分布的钨晶粒平均尺寸约为16 nm.
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