对Cu单晶体、双晶体和多晶体疲劳损伤微观机制的总结结果表明:在中、低应变范围Cu单晶体的疲劳裂纹主要沿驻留滑移带萌生,而在高应变范围则沿粗大形变带萌生;Cu双晶体中疲劳裂纹总是优先沿大角度晶界萌生和扩展,而小角度晶界则不萌生疲劳裂纹;对于Cu多晶体,疲劳裂纹主要沿大角度晶界萌生,有时也沿驻留滑移带萌生,而孪晶界面两侧由于滑移系具有相容的变形特征而未观察到疲劳裂纹萌生.
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