用磁控溅射工艺分别在Si和Al2O3衬底上沉积两种不同织构组分的多晶柱状Cu膜,基于动力学标度方法表征两种薄膜的表面粗化特征.结果表明,Cu(111)取向晶粒组分多的薄膜的生长指数较大、表面粗化速率较快.对于较低温度下沉积的多晶柱状薄膜,基于其晶粒几何形态和弱化的晶界限制的特点,提出了一种表面粗化机制,认为薄膜的表面粗化主要依赖于其晶粒表面的粗化过程,而薄膜织构决定了薄膜表面粗化速率.
参考文献
[1] | Dumay B,Finot E,Theobald M,Legaie O,Durand J,Baclet P,Goudonnet J P.J Appl Phys,2002; 92:6572 |
[2] | Family F,Vicsek T.J Phys,1985; 18A:L75 |
[3] | Chame A,Reis F D A A.Surf Sci,2004; 553:145 |
[4] | Kardar M,Parisi G,Zhang Y C.Phys Rev Lett,1986; 56:889 |
[5] | Lai Z W,Sarma S D.Phys Rev Lett,1991; 66:2348 |
[6] | Karabacak T,Zhao Y P,Wang G C,Lu T M.Phys Rev,2001; 64B:085323 |
[7] | Dalakos G T,Plawsky J P,Persans P D.Phys Rev,2005; 72B:205305 |
[8] | Tong W M,Williams R S,Yanase A,Segawa Y,Anderson M S.Phys Rev Lett,1994; 72:3374 |
[9] | Knepper R,Messier R.Proc SPIE,2001; 4467:87 |
[10] | Xia L F.Duffusion in Metals.Harbin:Publishing House of Harbin Institute of Technology,1989:137(夏立芳.金属中的扩散.哈尔滨:哈尔滨工业大学出版社,1989:137) |
[11] | Mullins W W.J Appl Phys,1957; 28:333 |
[12] | Herring C.Phys Rev,1951; 82:87 |
[13] | Okolo B,Lamparter P,Welzel U,Wagner T,Mittemeijer E J.Thin Solid Films,2005; 474:50 |
[14] | Tang W,Xu K W,Wang P,Li X.Acta Metall Sin,2002; 38:9(唐武,徐可为,王平,李弦.金属学报,2002;38:9) |
[15] | Freund L B,Suresh S.Thin Film Materials Stress,Defect Formation and Surface Evolution.Cambridge:Cambridge University Press,2003:550 |
[16] | Lita A E,Sanchez J E.Phys Rev,2000; 61B:7692 |
[17] | Siegert M.Phys Rev Lett,1998; 81:548 |
[18] | Lukaszew R A,Clarke R.Appl Surf Sci,2002; 191:118 |
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