利用SEM对冷喷涂工艺中不同气体温度下Ni粒子碰撞Cu合金基板后的结合及变形形貌进行了表征.结果表明,随着气体温度的升高,粒子扁平率呈渐缓趋势增加,射流面积增大,粒子的结合率提高.变形粒子内存在剪切失稳薄层、强塑性变形区和低塑性变形区等3个变形程度不同的区域.粒子与基板的结合质量主要受剪切失稳薄层控制,而变形后粒子的形状主要受塑性变形区控制.证实了绝热剪切失稳是Ni粒子与Cu合金基板结合的主要机制.
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