研究了退火温度对冷静液挤压铜包铝线材组织和性能的影响规律,在界面断裂形式分析的基础上探讨了其作用机理.结果表明:直径为6 mm的冷静液挤压态铜包铝线材合理的退火温度为350℃.低于200℃退火时,纯Cu包覆层只发生回复,复合线材的力学性能得以部分恢复;350℃退火时,铜层再结晶基本完成,复合线材的抗拉强度降到最低,延伸率则达到最高;400℃退火时,铜层晶粒开始长大,复合线材的延伸率开始劣化.界面结合强度随温度的变化呈先增加后降低的趋势,而界面的断裂则由低温退火时的铝基体塑性断裂转变为高温退火后Cu/Al界面的脆性断裂.
参考文献
[1] | Kang C G,Jung Y J,Kwon H C.J Mater Process Technol,2002; 124:49 |
[2] | Xu R C,Tang D,Ren X P,Wang X H,Wen Y H.Rare Met,2007; 26:230 |
[3] | Braunovic M,Aleksandrov N.Proc 38th IEEE Holm Conf of Electrical Contacts,Philadelphia,USA,18-21 Oct.,1992:25 |
[4] | Chen S D,Ke F J,Zhou M,Bai Y L.Aeta Mater,2007; 55:3169 |
[5] | Lee W B,Bang K S,Jung S B.J Alloys Compd,2005;390:212 |
[6] | Lee J E,Bae D H,Chung W S,Kim K H,Cho Y R.J Mater Process Technol,2007; 187-188:546 |
[7] | Heness G,Wuhrer R,Yeung W Y.Mater Sci Eng A,Available Online at www.sciencedirect.com,16 May,2007,in Press |
[8] | Moreno D,Garrett J,Embury J D.Intermetallics,1999;7:1001 |
[9] | Hang C J,Wang C Q,Mayer M,Tian Y H,Zhou Y,Wang H H.Microelectron Reliab,2008; 48:416 |
[10] | Chen C Y,Chen H L,Hwang W S.Mater Trans,2006;47:1232 |
[11] | Shen L.Master Degree Dissertation,Kunming University of Science and Technology,2002(沈黎.硕士学位论文,昆明理工大学,2002) |
[12] | Shackelford J F,Alexander W.Materials Science and Engineering Handbook.Boca Raton,FL:CRC Press LLC,2001:1 |
[13] | Ying D Y,Zhang D L.J Alloys Compd,2000; 311:275 |
[14] | Tomida S,Nakata K,Saji S.Surf Coat Technol,2001;142-144:585 |
[15] | Ouyang J,Yarrapareddy E,Kovacevie R.J Mater Process Technol,2006; 172:110 |
[16] | Peng X K,Wuhrer R,Heness G,Yeung W Y.J Mater Sci,1999; 34:2029 |
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