Ag3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响

金属学报, 2009, 45(8): 912-918. doi: 10.3321/j.issn:0412-1961.2009.08.003

Ag3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响

1.中国科学院金属研究所沈阳材料科学国家,(联合),实验室,沈阳,110016

2.中国科学院金属研究所沈阳材料科学国家,(联合),实验室,沈阳,110016

3.中国科学院金属研究所沈阳材料科学国家,(联合),实验室,沈阳,110016

4.中国科学院金属研究所沈阳材料科学国家,(联合),实验室,沈阳,110016;Department of Materials Science and Engineering,University of Illinois at Urbana-Champaign,Urbana,IL61801,USA

基金项目: 国家重点基础研究发展规划(973计划)(2004CB619306)

关键词：无铅焊料 , 粒于粗化 , 电流

MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER

本文用位错蠕变模型,描述了在电流作用下,无铅焊料Sn-Ag-Cu(SAC)中第二相粒子AgaSn的粗化过程及其对蠕变速率的影响.模型中焊料组织被简化为:β-Sn母相基体和在基体上弥散分布的Ag3Sn第二相粒子.基于Lifshitz-Wagner理论,得到了描述第二相粒子尺寸演化的关系式,式中包括稳态应变和电流作用引起的两部分粗化.

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Ag3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响

MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER

参考文献