多层片式电感器介质材料及其工艺的发展现状

无机材料学报, 2001, 16(6): 1032-1040. doi: 10.3321/j.issn:1000-324X.2001.06.002

多层片式电感器介质材料及其工艺的发展现状

罗凌虹 ^1, , 周和平 ^2, , 黄河激 ^3, , 王少洪 ^4,

1.清华大学材料工程系

2.清华大学材料工程系

3.清华大学材料工程系

4.清华大学材料工程系

关键词：多层片式电感(MLCIs) , 低烧介质材料 , 多层片式工艺

Development of Dielectric Materials and Processing for Mulitilayer Chip Inductors

综述了近年来国内外多层片式电感器介质材料及其工艺研究的发展现状和方向,介绍了不同的频率段,应选择不同的低烧材料作为器件的介质材料,特别针对有关用于高频MLCIs的低介瓷的研究进行了详细的介绍.同时慨括了多层片式电感器生产的特殊而典型工艺过程.

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多层片式电感器介质材料及其工艺的发展现状

Development of Dielectric Materials and Processing for Mulitilayer Chip Inductors

参考文献