利用复合结构原理,研制出"硼硅玻璃+α-石英+硅酸锌"系低烧低介陶瓷材料,利用XRD、HP4194频谱仪、SEM分析了该材料的晶相组成、介电性能及显微结构.结果表明:在高频下,该材料具有很低的介电常数(K=4～5,1MHz)和很低的介电损耗(tanδ<0001,1MHz),同时能在低于900℃温度下烧结.该材料是一种理想的适用于高频(1GHz以上)多层片式电感(MLCIs)元件用的介质材料.同时得出:在该组成中,硼硅玻璃重烧结的过程中有方石英析出;少量硅酸锌由于锌离子进入玻璃中而转变为亚硅酸锌;硅酸锌在该组成中有助烧结的作用,该材料介电性能随频率的变化与德拜方程的描述基本吻合.
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