采用聚合物前驱体法制备了CeO2-CuO-doped SnO2纳米粉体,并研究了掺杂SnO2纳米粉体的无压烧结行为.结果表明:乙二醇、柠檬酸与金属离子的摩尔比为6:3:1时制得的掺杂SnO2粉体为分散良好的球形颗粒,大小为～15nm,粒度分布范围窄;CuO掺杂可显著提高SnO2的烧结性能,CeO2-CuO复合掺杂可进一步降低SnO2陶瓷的致密化温度;1.0%CeO2-1.5%CuO-doped SnO2可在1050℃烧结致密,相对密度达96%以上;两步法(先升温到1050℃保温15min,然后降到980℃烧结5h)烧结的1.0%CeO2-1.5%CuO-doped SnO2陶瓷相对密度为96.1%,其晶粒＜800nm.
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