欢迎登录材料期刊网

材料期刊网

高级检索

利用溶胶-凝胶法合成了两种不同居里温度的Ba0.80Sr0.20TiO3(BST-80)和Pb0.82La0.12TiO3(PLT-12) 铁电陶瓷微粉.以陶瓷微粉, 低熔点玻璃粉末PbO-B2O3等混合配制浆料, 应用丝网印刷法在ITO石英玻璃基板上制备厚膜, 并在550~750℃温度下于密封的石英套管中烧结致密化, 成功的在750℃低温下制备出BST-80和PLT-82晶相稳定共存的复合厚膜.厚膜的相关性能通过X射线衍射仪(XRD)、扫描电子显微镜(SEM)、阻抗仪(LCR)等手段进行测试.结果表明, 厚膜的形成主要通过750℃下PbO-B2O3玻璃相的浸润及均匀包裹到颗粒表面并经颗粒在玻璃相中一定的液相传质过程而致密化; 通过控制玻璃相的包裹及控制颗粒的扩散实现颗粒相的稳定共存.厚膜中PLT-82晶相的晶格受Pb2+离子扩散进入玻璃相而略有缩小.这种复合厚膜的介电常数在较宽的温度范围0~300℃间的变化率<18%, 具有较高的温度稳定性.

参考文献

[1] Cheng J G, Tang J, Zhang A J, et al. Applied Physics A, 2000, 71: 667-670.
[2] Alguer'o M, Kholkin A, Calzada M L, et al. Applied Physics A, 2000, 71: 195-202.
[3] Qu W M, Wlodarski W, Green R, et al. Proceedings of 1999 Optoelectronic and Microelectronic Materials Devices, 1999. 158-161.
[4] Wolny W W. Proceedings of the 2000 12th IEEE International Symposium on Applications of Ferroelectrics, 2000. ISAF 2000. 2000, 1: 257-262.
[5] Burianova L, Kopal A, Nosek J. Materials Science and Engineering B, 2003, 99: 187-191.
[6] Tavernor A W, Li H P, Stevens R. Journal of the European Ceramic Society, 1999, 19: 1859-1863.
[7] Hollingsworth M D. Science, 2002, 295: 2410-2413.
[8] HornsbyJ S, Das-Gupta D K. Journal of Applied Physics, 2000, 87: 467-454.
[9] Wu Y J, Uekawa N F, Sasaki Y, et al. Journal of the American Ceramic Society, 2002, 85: 1988-1992.
[10] Wu R, Du P Y, Zhang H F, et al. Journal of Iron and Steel Research International, 2002, 6: 220-224.
[11] Hiroyuki S, Hirofumi M, Makoto K. Journal of Sol-Gel Science and Technology, 1999, 16: 129-134.
[12] Kim T Y, Jang H M, Cho S M. Solid State Communications, 2001, 119: 527-532.
[13] Miguel A M, Lourdes C, Lorena P. Journal of Materials Research, 1999, 14: 4302-4306.
[14] Baltazar-Rodriguesa J, Eiras J A. Journal of the European Ceramic Society, 2002, 22: 2927-2932.
[15] Alguero M, Calzada M L, Quintana C, et al. Applied Physics A: Materials Science and Processing, 1999, 68: 583-592.
[16] Du P, Miranda Salvado I M, Vilarinho P M. Thin Solid Films, 2000, 375: 19-23.
[17] Su B, Holmes J E, Cheng B L, et al. Journal of Electroceramics, 2002, 9: 113-118.
[18] Grogger W, Hofer F, Warbichler P, et al. physica status solidi, 1998, 166 (a): 315-325.
[19] Yang R Y, Lin M H, Lu H Y. Acta Materialia, 2001, 49: 2597-2607.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%