采用纯粉末,通过SPS烧结制备了组织均匀、致密且体积分数高的SiCp/Al电子封装材料.通过对SPS烧结现象的研究,认为该复合材料的SPS烧结过程属于反应性烧结,大部分收缩在极短时间内完成;另外对SiC体积分数和SiC颗粒尺寸对热导率、热膨胀系数的影响进行了研究,发现SiC体积分数越高,复合材料的热导率和热膨胀系数越低;SiC颗粒粒径增大,复合材料的热导率增高,而热膨胀系数减小.
参考文献
[1] | Zweben C.JOM,1992,44 (7):15-23. |
[2] | Lee HYO S,Jeon Kyung Y,Kim Hee Y,et al.J Mater Sci.,2000,35:6231-6236. |
[3] | 张崎.微电子技术,1999,27(2):30-34. |
[4] | Lee H S,Hong S H.Materials Science and Technology,2003,19 (8):1057-1064. |
[5] | Hwu Boq-Kong,Lin Su-Jien,Jahn Min-Ten.Materials Science & Engineering A,1996,207:135-141. |
[6] | Urquhart A W.Materials Science & Engineering A,1991,144:75-82. |
[7] | Hemambar C,Rao B S,Jayaram V.Materials Manufacturing Processes,2001,16 (60):779-788. |
[8] | Johnson D.Lynn.Ceramics International,1991,17:295-300. |
[9] | Tokita M.Materials Science Forum,1999,308-311:83-88. |
[10] | 尾崎公洋.Journal of the Japan Society of Powder and Powder Metallurgy,2000,47 (3):293-297. |
[11] | Laurent V,Chatain D,Eustathopoulos N.Materials Science and Engineering A,1991,135:89-94. |
[12] | 武高辉,张强,姜龙涛,等,电子元件与材料,2003,22(6):27-29. |
[13] | Chen Liang-Guang,Shue Kung-Hsien,Chang Shou-Yi,et al.J.Mater.Re.,2002,17 (2):376-385. |
[14] | Xu Y,Tanaka Y.Journal of Applied Physics,2004,95 (2):722-726. |
[15] | Elomari S,Skibo M D,A.Sundarrajan,et al.Composites Science and Technology,1998,58:369-376. |
[16] | Elomari S,Boukhili R,Marchi C San,et al.Journal of Materials Science,1997,32 (8):2131-2140. |
[17] | Shen Y L,Needleman A,Suresh S.Metallurgical and Materials Transactions,1994,25A:840-847. |
[18] | 张建云,华小珍,周贤良,等.电子元件与材料,2002,21(2):8-9. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%