利用原位测试系统得到细编穿剌C/C复合材料纤维/基体及纤维束/基体两种不同层次界面的顶出实验数据,然后利用界面弹簧模型对纤维及纤维束的顶出实验过程进行有限元法计算机模拟,编制了分析程序,得到了不同层次界面的剪切强度值.
To fine weave & pierced C/C composites, at fiber/matrix and fiber bundle/matrix two different level interfaces, the push-out test results are obtained using in situ interfacial strength testing instrument. Then using an interface spring element model, the finite element computer simulation methods are employed to simulate the fiber and fiber bundle push-out test processes. The analysis program is written and the interface shearing strengths of different level interfaces are obtained.
参考文献
| [1] | 任学佑, 马福康. C/C复合材料的发展前景[J]. 材料导报, 1996,10(2):73. |
| [2] | 郭正, 赵稼祥. C/C复合材料的研究与发展[J]. 宇航材料工艺, 1995,25(5):1-4. |
| [3] | Chandra N, Ananth C R. Analysis of interfacial behavior in MMCs and IMCs by the use of thin-slice push-out tests[J]. Composites Science and Technology, 1995, 54(1):87-100. |
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