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利用自制的离心高速电沉积实验装置,研究了镀液温度、镀液pH值、电流密度、镀液中SiC浓度和阴极旋转速度对Ni-SiC复合镀层中SiC含量的影响;同时还对镀层中SiC微粒的分布情况及镀层的性能进行了研究.结果表明:温度、电流密度、镀液中的SiC含量及阴极旋转速度对镀层中复合粒子的含量有显著的影响,而pH值对镀层中SiC含量影响不大.利用离心高速电沉积方法能够制备出高体积分数的、微粒分布均匀的Ni-SiC复合镀层.所制备的高体积分数的Ni-SiC复合镀层硬度和耐磨性能优于普通槽镀镀层.

参考文献

[1] Celis J P, Roos L R, Buelens C, Grasaer L. Mechanism of electrolytic composite plating: survey and trends [J]. Trans Inst Metal Finish,1991,69(4):133-139.
[2] 闫洪.化学镀Ni-P-B4C复合镀层的耐磨性[J].复合材料学报,1995,12(4):45-48.
[3] 王玉林,赵乃勤,董刚,等.Al2O3颗粒粒径和含量对α-Al2O3/Cu复合镀层性能的影响[J].复合材料学报,1998,15(1) :42-45.
[4] Stankovic V D, Gojo M. Electrodeposited composite coatings of copper with inert, semiconductive and conductive particles[J]. Surface and Coatings Technology, 1996, 81 (2- 3): 225-231.
[5] 邵光杰,马焕明,王海燕,荆天辅,姚枚.离心高速电镀镍工艺研究[J].电镀与涂饰,2000,19(2):10-12.
[6] 郭鹤桐,张三元.复合镀层[M].天津:天津大学出版社,1991. 74-307.
[7] Zahavi J, Hazan J. Electrodeposited nickel composites containing diamond particles [J]. Plating and Surface Finishing, 1983,70(2) :57-61.
[8] Kenteposidou A, Kiparissides C, Kotzia F. Nickel / microcapsules composite electrocoatings: the synthesis of water-containing microcapsules and preparation of the coatings [J]. J Materials Scienc, 1996,31 (5): 175 - 180.
[9] Kareapperam J K, Foster J. Further studies on the mechanism of electrodeposited composite coatings [J]. Trans Inst Met Finish, 1974,52(8):87-91.
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