基底温度对Ag-MgF2金属陶瓷薄膜内应力的影响

复合材料学报, 2004, 21(2): 22-26. doi: 10.3321/j.issn:1000-3851.2004.02.004

基底温度对Ag-MgF2金属陶瓷薄膜内应力的影响

李爱侠 ^1, , 孙大明 ^2, , 孙兆奇 ^3, , 宋学萍 ^4, , 赵宗彦 ^5,

1.安徽大学,物理系,合肥,230039

2.安徽大学,物理系,合肥,230039

3.安徽大学,物理系,合肥,230039

4.安徽大学,物理系,合肥,230039

5.安徽大学,物理系,合肥,230039

基金项目: 国家自然科学基金(59972001) 安徽省教育厅科研项目(99JL0024) 安徽省自然科学基金(01044901)

关键词： Ag-MgF2金属陶瓷薄膜 , 应力 , 基底温度 , 微结构

EFFECT OF SUBSTRATE TEMPERATURE ON RESIDUAL STRESS IN Ag-MgF2 CERMET FILMS

用电子薄膜应力分布测试仪测量了基底温度对Ag-MgF2金属陶瓷薄膜内应力的影响.结果表明:基底温度在300℃～400℃范围内,φ20.4 mm选区内的薄膜平均应力最小,应力分布比较均匀,应力为张应力.XRD分析表明:当基底温度在300℃～400℃范围内,Ag-MgF2薄膜中的Ag和MgF2组分的晶格常数接近块体值,说明通过改变基底温度可以降低薄膜内应力.

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基底温度对Ag-MgF2金属陶瓷薄膜内应力的影响

EFFECT OF SUBSTRATE TEMPERATURE ON RESIDUAL STRESS IN Ag-MgF2 CERMET FILMS

参考文献