甲基二苯乙炔基硅烷(MDPES)聚合后具有耐高温、低介电损耗等优异性能,但力学性能低.采用双(N-间乙炔基苯基邻苯二甲酰亚胺)醚(DAIE)添加到MDPES中进行共聚改性.通过二者不同质量配比的共聚反应发现,当MDAIE/MMDPES=4:5时,共聚后改性效果较好,在氮气中的Td5(质量损失5%时的温度)为467℃,800℃时质量保留率为82.7%,所制备的复合材料在常温下弯曲强度达到274 MPa;高温弯曲强度保留率为88.5%.在频率为1 MHz时介电常数为4.18,介电损耗角正切tanδ为2.5×10-3.
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