采用电磁离心铸造(EMCC)工艺制备SiCP/Al复合材料,实验了两种不同粒度的SiCP颗粒增强Al基体,测定了不同励磁电压下颗粒在基体中的分布,测试了不同粒度增强基体均匀分布的材料的硬度和耐磨性.结果发现电磁搅拌更容易使小粒度的颗粒分布均匀.励磁电压为100V时的颗粒分布比励磁电压为50 V时的颗粒分布更均匀.均匀分布的小颗粒增强基体的复合材料的硬度和耐磨性有很大提高.
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