根据Si3N4颗粒增强体的结构特点及等温化学气相法(ICVI)的工艺特点,对Si3N4颗粒增强Si3N4复合材料的致密化过程进行了数值模拟.用球形孔隙模型表征Si3N4颗粒增强体的结构特征,用传质连续方程表征先驱体在预制体中的浓度分布.为了检验模型的准确性和适用性,进行了相应的实验验证.模拟结果与实验结果具有相似的致密化规律,预测的渗透时间和孔隙率与实验结果均十分接近,表明本文中建立的数学模型可以较好地表征Si3N4P/Si3N4复合材料的ICVI过程.
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