研究了挤压温度对粉末挤压法制备镁基复合材料室温拉伸性能和断口形貌的影响.实验结果表明: 复合材料在350～450℃温度范围内挤压温度越高,SiC颗粒分布越均匀,致密度越高,复合材料强度、延伸率上升; 复合材料断裂方式随着挤压温度升高由颗粒/基体脱粘向颗粒断裂转变.
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