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研究了外加电场对T2紫铜和1Cr18Ni9Ti不锈钢摩擦焊接头焊合区的显微组织、主要合金元素的扩散区宽度以及接头力学性能的影响.结果表明,外加电场加快了焊合区金属的动态再结晶进程,不同形式的电场对焊合区铜侧的组织形态与分布有不同的影响.在负电场(试件接电源负极)作用下,焊合区金属发生的动态再结晶程度最大,晶粒尺寸较大且分布均匀;交流电场使晶粒尺寸略有减小.交流电场和负电场通过对金属内部电子密度的影响,促进了焊接过程中焊缝区Cu、Fe和Cr的扩散,并提高了焊接接头扭转强度.

参考文献

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