提出了伪半固态触变成形技术,并利用2024铝合金和SiCp成形卫星角框件试验说明了主要工艺过程.用伪半固态触变成形技术能够成形陶瓷基复合材料,成形温度大大低于高熔点相纳米粉体熔化温度.用伪半固态触变成形工艺制备出的试样具有比较均匀、密实的微观组织结构、一定的塑性变形和比较高的硬度,达到了近净成形的程度.在成形过程中压力容易消除粘结体充填后的凝固缺陷.
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