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用喷射铸造法制备了CuCr25触头合金,研究了工艺参数(雾化压力和沉积距离)对合金组织形态和性能的影响.结果表明:采用优化的工艺参数和锻造过程制备出的CuCr25合金致密、组织良好,合金中Cr粒子平均直径为5~10μm,且均匀、弥散地分布于铜基体中.细小的Cr粒子提高了合金作为电触头材料的性能.经800℃锻压后,材料的密度>8.4 g/cm3,电导率为28.5×106Q-1·m-1,硬度为108 HB.

参考文献

[1] Y.Kashiwagi,Contact of Vacuum Interrupter and Manufacture Process,U.S.patents 4554425(1985)
[2] R.Muller,Simens Forsch.-u-Entwickl-Ber.Bd,17(3),105(1988)
[3] ZHOU Wuping,High Voltage Aparatus,5,55(1992)
[4] P.G.Slade,IEEE Trans on CPMT,17(1),96(1994)
[5] W.F.Rieder,M.Schussek,W.Glazle,E.Kny,IEEE Trans on CPMT,12(2),273(1989)
[6] F.Frey,N.Klink,R.Michal,K.E.Staeger,IEEE Trans on Plasma Science,5,1069(1989)
[7] M.Hansen,K.Anderko,Constitution of Binary Alloys,(New York,MeGraw Hill,1958) p.524~525
[8] M.Cohen,B.H.Kear,R.Mehrabian,In R.Mehrabian.B.H.Kear and M.Cohen (eds.),Proc.2nd Int.Conf.on Rapid Solidification Processing Principle and Technologies,(Baton Rouge,LA,Claitor's Publishing Division,1980) p.1
[9] LIU Hongwei,ZHANG Yong'an,ZHU Baohong,Rare Earth,28(2),372(2004)(刘红伟,张永安,朱宝宏,稀有金属,28(2),372(2004))
[10] P.S.Grant,Progress in Materials Science,39,497(1995)
[11] D.E.Tyler,W.G.Watson,PM TEC 95,Seattle,1995
[12] ZHAO Feng,XU Hui,YANG Zhiyuan,DING Bingjun,Tran.Nonferrous Met.Soc.China,10(1),150(2000)
[13] ZHANG Chengyu,WANG Yaping,YANG Zhimao,GUO Yong,DING Bingjun,Journal of Alloys and Compounds,366(1~2),289(2004)
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