评述了用鼓膜实验方法测试薄膜与基体界面结合强度的现状和最新进展,分析了该方法针对圆孔、膜内无残余应力柔性膜试样和矩形孔或圆孔、膜内有残余应力试样(薄膜为柔性膜或刚性膜)所用解析解力学模型建立的薄膜力学性能假设前提条件、能量平衡思路和推导过程.介绍了用硅微技术制备Si基体试样的过程,指出了制备方法和解析解力学模型的特点及所存在的问题.给出了该实验方法的应用实例,指出了需要解决非硅基体的制样和薄膜塑性变形阶段力学模型等问题.
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