使用Gleeble-3800热模拟试验机模拟单道次焊接条件下大厚度(50 mm)F460钢板热影响区(HAZ)热循环过程,通过OM,SEM,EBSD和TEM研究了HAZ的显微组织随热输入(E)的演化规律.测试了不同E下HAZ的室温硬度(HV),在-40和-60℃下进行了Charpy冲击示波实验(CVN).当E=15 kJ/cm时,显微组织为高位错密度板条马氏体(LM),板条间呈现出大取向差,板条间存在细小片状马氏体/奥氏体(M/A)组元.当E=30 kJ/cm时,板条贝氏体(LB)形成,随着E提高至50 kJ/cm,板条宽度增大,且有粒状贝氏体(GB)形成,大角度晶界减少,M/A组元粗化.当E为10m-300 kJ/cm时,HAZ的显微组织由GB+上贝氏体(UB)+准多边形铁素体(QPF)构成,组织均匀性恶化.HAZ的硬度、CVN最大载荷(Pm)、脆性断裂止裂载荷(Pa)、脆性断裂裂纹扩展速率、CVN载荷降至0时的位移(d0)等均随着E的增加而降低.脆断单元解理面尺寸随E的提高而逐渐增大,从而揭示HAZ铁素体等效晶粒尺寸随E的提高而增大、低温韧性随E的提高而降低的规律.E不高于30 kJ/cm时,在-60℃下的HAZ与母材的韧性相匹配.
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