在硼酸缓冲溶液中,采用动电位极化、电化学阻抗谱(EIS)和半导体电容分析方法分别研究了Clˉ浓度(0.5-2 mol/L)和溶液温度(25-80℃)对690合金腐蚀行为的影响,并结合AFM,XPS及电位-pH图分析了钝化膜层的腐蚀产物.结果表明,不同Clˉ浓度和温度的溶液中,690合金均表现出沿晶腐蚀和二次钝化的特征.Clˉ浓度和溶液温度的提高均使690合金的自腐蚀电位下降,腐蚀电流密度增大,同时温度的升高还使690合金的点蚀电位降低,钝化区间变窄.恒电位极化相同时间,低电位的钝化区内的腐蚀产物主要为Cr,Fe的氧化物和Ni(OH)2,钝化膜较薄且致密性好,体现n型与p型共存的特征.高电位的钝化区内的腐蚀产物主要为Ni2O3,钝化膜较厚但致密性差,体现n型半导体特征.
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