欢迎登录材料期刊网

材料期刊网

高级检索

采用苯并三氮唑(BTA)复配钝化体系对B10 Cu--Ni合金进行钝化处理,以提高其在含硫化物环境介质中的耐腐蚀性能, 并研究工艺参数对钝化膜耐蚀性的影响规律. 利用动电位极化曲线和电化学阻抗谱研究钝化膜的耐腐蚀性能, 采用X射线光电子能谱分析钝化膜的化学成分.实验结果表明, 在BTA与磺基水杨酸组成的复配体系中形成的钝化膜比BTA单一体系中形成的钝化膜具有更高的耐蚀性, 这是磺基水杨酸与基体合金反应形成的络合物膜与Cu(I)BTA膜协同作用的结果; 钝化处理的时间和温度是影响钝化膜耐蚀性的重要工艺参数, 延长钝化时间和提高钝化温度均可以提高钝化膜的耐蚀性, 60 ℃高温条件下5 min的钝化处理即能够达到常温条件下3 h的钝化处理效果.

Cu-Ni alloy has excellent corrosion resistance in marine environment and so it is widely used as seawater pipework in ships; however its corrosion resistance will decrease rapidly in sulphide--polluted seawater. Benzotriazole (BTA) is an excellent inhibitor for corrosion of copper and its alloys due to the formation of passivation film of Cu(I)BTA. In this work, passivation film was prepared on B10 Cu--Ni alloy in compound BTA passivant for improving its corrosion resistance against sulphide--polluted seawater. Corrosion resistance of the passivation films was studied by potentiodynamic polarization test and electrochemical impedance spectroscopy (EIS); surface wettability of the films was characterized using contact angle test; X--ray photoelectron spectroscopy (XPS) was used to analyze the chemical compositions of the films. The results show that the passivation film prepared in compound passivant containing BTA and sulfosalicylic acid has better corrosion resistance than that in single BTA passivant; the higher corrosion resistance of the compound film results from synergetic effect of Cu(I)BTA and a complex compound which is a reaction product between sulfosalicylic acid and Cu alloy. Time and temperature of passivating treatment have important effects on corrosion resistance of the passivation film; prolonged treatment time and high treatment temperature are beneficial to improving corrosion resistance of the passivation film.

参考文献

[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[12]
[13]
[14]
[15]
[16]
[17]
[18]
[19]
[20]
[21]
[22]
[23]
[24]
[25]
[26]
[27]
[28]
[29]
[30]
[31]
[32]
[33]
[34]
[35]
[36]
[37]
[38]
[39]
[40]
[41]
[42]
[43]
[44]
[45]
[46]
[47]
[48]
[49]
[50]
[51]
[52]
[53]
[54]
[55]
[56]
[57]
[58]
[59]
[60] Zhang J, Wang Q, Wang Y M, Dong C. 
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%