通过OM,TEM和EBSD等分析手段,并结合热膨胀测试法,研究了Cu对690 MPa级HSLA钢焊丝熔敷金属组织转变及组织细化的作用,并对细化机理进行了探讨.研究结果表明,熔敷金属的组织主要由板条状贝氏体(LB)、粒状贝氏体(GB)和残余奥氏体(AR)组成,Cu含量从0.24％增加到0.53％时,马氏体/奥氏体(M/A)组元数量由0.62％减少到0.31％,并且形状也由小块状、条状向颗粒状转变;残余奥氏体数量增多;同时,组织的亚结构得到明显细化,贝氏体板条块尺寸和板条平均宽度分别从2.18和0.39 μm减少到1.99和0.36 μm,可阻碍裂纹扩展的大角度晶界的比例也由68.5％增加到71.0％.通过对晶粒细化原因进行分析发现,Cu能降低奥氏体转变温度,增加奥氏体的稳定性,使相变时铁素体自由能(Gα)和奥氏体自由能(Gγ)差值增大,减小临界晶胚尺寸;同时,相变温度的降低也降低了C的扩散速率,使已形核的晶胚长大速率减慢,最终细化了亚晶粒结构.
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