利用改良型硫酸盐- 氯化物镀液体系,进行了晶圆级Fe-Ni凸点下金属层(UBM)电镀工艺的开发研究.研究了镀液中Fe2+含量、电镀温度及电流密度对镀层成分的影响规律,得到了特定工艺条件下镀层成分控制的完整曲线;测量了不同电镀时间和不同电流密度下的镀层生长速率,为实际生产中控制UBM镀层的厚度提供了依据;利用XRD和TEM对镀层的晶体结构及微观形貌进行了表征;利用滴定、等离子体发射光谱(ICP)等手段,对镀液在生产及静置条件下主盐离子浓度的变化趋势进行了监测,测定了抗坏血酸在镀液体系中与Fe3+的反应能力,提出了镀液的日常维护、保存、调控方案以及Fe3+的抑制方案.
参考文献
[1] | O'Donnell T,Wang N N,Kulkarni S,Meere R,Rhen F M F,Roy S,O'Mathuna S C.J Magn Magn Mater,2010;322:1690 |
[2] | Esmaili S,Bahrololoom M E,Kavanagh K L.Mater Charact,2011; 62:204 |
[3] | Leith S D,Ramli S,Schwartz D T.J Electrochem Soc,1999; 146:1431 |
[4] | Koo B,Yoo B.Surf Coat Technol,2010; 205:740 |
[5] | Zeng K,Tu K N.Mater Sci Eng,2002; R38:55 |
[6] | Yan Y F,Wang W L,Chen G F.Pb free Solders in SMT.Beijing:Publishing House of Electronics Industry,2010:102(闫焉服,王文利,陈冠方.电子装联中的无铅焊料.北京:电子工业出版社,2010:102) |
[7] | Dariavach N,Callahan P,Liang J,Fournelle R.J Electron Mater,2006; 35:1581 |
[8] | Zhu Q S,Guo J J,Shang P J,Wang Z G,Shang J K.Adv Eng Mater,2010; 12:497 |
[9] | Guo J J,Zhang L,Xian A P,Shang J K.J Mater Sci Technol,2007; 23:811 |
[10] | Zhang H,Zhang L,Duan Z Z,Liu Z Q.Sci J Microelectron,2012; 2:13(张昊,张黎,段珍珍,刘志权.微电子期刊,2012:2:13) |
[11] | Huang Z X,Wu C S.Theory of Electroplating. Beijing:China Machine Press,1982:5(黄子勋,吴纯素.电镀理论.北京:机械工业出版社,1982:5) |
[12] | Chen T Y.Electroplating of Nickel Alloy.Beijing:Chemical Industry Press,2007:18(陈天玉.镀镍合金.北京:化学工业出版社,2007:18) |
[13] | Han P X.Environ Sci Technol.2006; 29:42(韩平学.环境科学与技术,2006; 29:42) |
[14] | Chen T Y. Trouble Settlement and Actual Samples of Nickel Plating. Beijing:Chemical Industry Press,2010:19(陈天玉.镀镍故障处理及实例.北京:化学工业出版社,2010:19) |
[15] | Li P,Lu L,Liu T C,Sun K,Lu Z C,Lu Y P.J Funct Mater,2001; 38:32(李鹏,卢琳,刘天成,孙克,卢志超,卢燕平.功能材料,2001; 38:32) |
[16] | Liu T C,Lu Z C,Li D R,Lu Y P,Sun K,Zhou S X.J Univ Sci Technol Beijing,2006; 28:298(刘天成,卢志超,李德仁,卢燕平,孙克,周少雄.北京科技大学学报,2006; 28:298) |
[17] | Han Y,Wang P,Wang B Y,Qin Q X.Plat Finish,1997;19:8(韩勇,王萍,王宝玉,覃奇贤.电镀与精饰,1997; 19:8) |
[18] | Tabakovic I,Inturi V,Thurn J,Kief M.Electrochim Acta,2010; 55:6749 |
[19] | Su X H,Qiang C W.Bull Mater Sci,2012; 35:183 |
[20] | Rousse C,Fricoteaux P.J Mater Sci,2011; 46:6046 |
[21] | Grimmett D L,Schwartz M,Nobe K.J Electrochem Soc,1993; 140:973 |
[22] | Kieling V C.Surf Coat Technol,1997; 96:135 |
[23] | Li P,Liu T C,Sun K,Lu Y P,Lu Z C.Electroplat Finish,2005; 24:6(李鹏,刘天成,孙克,卢燕平,卢志超.电镀与涂饰,2005; 24:6) |
[24] | Tabakovic I,Inturi V,Thurn J,Kief M.Electrochim Acta,2011; 56:2616 |
[25] | Chen T Y.Technological Foundation of Nickel Plating.Beijing:Chemical Industry Press,2011:37(陈天玉.镀镍工艺基础.北京:化学工业出版社,2011:37) |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%